FJD5555TM
High Voltage Fast Switching Transistor
Test Standards: - Moisture Sensitivity: 1
- Thermal Impedance: 2/63
- Physical Dimensions: TO-252(DPAK)
- ESD HBM: 2000
- ESD MM: 200
| General Information | | Device Marking(TOP MARK) | $Y&Z&3&K
J5555
| | | Family Code | 0S3 | | | Package Type | TO-252(DPAK) | | | Package Description | 002, MOLDED PACKAGE, TO-252 2 LDS. SMD | | | Pin Count | 2 | | | FIT | 11.5 | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Die Fabrication | | Fabrication Process Identifier | DI5555A | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Thermal Impedance (Theta JA) | 63 | °C/Watt | | Thermal Impedance (Theta JC) | 2 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 2000 | V | | ESD Machine Model (MM) | 200 | V | | Package Assembly* | |
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| UL Flammability Rating | DPG | | | Wire Material | AL | | | Wire Diameter | 6.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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