FJMA790

PNP Epitaxial Silicon Transistor

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y &O790&C &.&O&V
Family Code	05C
Package Description	6LD,MLP,DUAL,JEDEC MO-229,2MM SQUARE
FIT	28.2
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	80	°C/Watt
Thermal Impedance (Theta JC)	40	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	16	V
ESD Machine Model (MM)	2	V
Package Assembly*
DAP Size	6L
Frame Material	1.100X1.704MM
Die Attach Type	Epoxy / QMI 519
Wire Material	Cu
Wire Diameter	2.0 MIL

*If an attribute is listed twice, either can be used on the part.