FJPF13009H2TU

NPN Silicon Transistor

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y J13009-2 &3&K
Family Code	0S3
Package Type	TO-220F
Package Description	003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK
Pin Count	3
FIT	11.5
Die Fabrication
Fabrication Process Identifier	DD5052C
Package Assembly*
Moisture Sensitivity	NA
DAP Size	283*244 MILS
Frame Material	DUAI GAGE SINGLE STAND
Wire Material	AL
Wire Diameter	10.0 MIL

*If an attribute is listed twice, either can be used on the part.