| General Information |
| Device Marking(TOP MARK) | $Y&Z&3
K08P
N60S
| |
| Family Code | 0SN | |
| Package Type | TO-92 | |
| Package Description | 3 LD PLASTIC PKG (APK=AM) | |
| Pin Count | 3 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver | |
| Lead Pitch | 1270 | |
| Minimum Lead Spacing | 810 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 8000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 500 | V |
