| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FM75
M8
| |
| Family Code | 0AL | |
| Package Type | SOIC | |
| Package Description | 008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) | |
| Pin Count | 8 | |
| Die Size X | 69 | MLL |
| Die Size Y | 79 | MLL |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 1270 | |
| Minimum Lead Spacing | 760 | |
| Die Fabrication |
| Fabrication Process Identifier | FB0.8MSPDM | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
