FMBM5551

NPN General Purpose Amplifier

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y .3S2
Family Code	055
Package Type	SSOT-6
Package Description	006, PLASTIC MOLDED, SUPER SOT-6 PKG, DUAL, SMD (31)
Pin Count	6
FIT	2.7
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver
Lead Pitch	950
Minimum Lead Spacing	450
Die Fabrication
Fabrication Process Identifier	16
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
DAP Size	Matrix
Frame Material	Dual Die

*If an attribute is listed twice, either can be used on the part.