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| General Information | | Device Marking(TOP MARK) | &E&Y
&O105&C
&.&O&V
| | | Family Code | 05E | | | Package Type | MicroFET | | | Package Description | 6LD,MLP,DUAL,JEDEC MO-229, 2MM SQUARE,SINGLE DAP | | | Pin Count | 6 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 86 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 2000 | V | | ESD Machine Model (MM) | 200 | V |
*If an attribute is listed twice, either can be used on the part.
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