FPF1009

FPF1009 - IntelliMAX™ Advanced Load Products

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&E&Y &O009&C &.&O&V
Family Code	05E
Package Type	MicroFET
Package Description	6LD,MLP,DUAL,JEDEC MO-229, 2MM SQUARE
Pin Count	6
Die Fabrication
Fabrication Process Identifier	FS35C52BD
Package Assembly*
Thermal Impedance (Theta JA)	86	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	8000	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
DAP Size	6L
Frame Material	1.600X1.000MM
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	1.5 MIL

*If an attribute is listed twice, either can be used on the part.