| General Information |
| Device Marking(TOP MARK) | &E&Y
&O200&C
&.&O&V
| |
| Family Code | 05E | |
| Package Type | SC70 | |
| Package Description | 005, PLASTIC MOLDED SC70-5 LEAD PACKAGE, SMD | |
| Pin Count | 5 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 950 | |
| Minimum Lead Spacing | 450 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
