| General Information |
| Device Marking(TOP MARK) | &E&Y
&O148&C
&.&O&V
| |
| Family Code | 05E | |
| Package Type | MLP | |
| Package Description | 6LD,MLP,DUAL,JEDEC MO-229,2MM SQUARE | |
| Pin Count | 6 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Die Fabrication |
| Fabrication Process Identifier | 5E8FS50BPOAD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 4000 | V |
| ESD Machine Model (MM) | 400 | V |
| Package Assembly* |
| DAP Size | 6L | |
| Frame Material | 1.600X1.000MM | |
| Wire Material | Au | |
| Wire Diameter | 1.3 MIL | |
| Die Attach Type | Epoxy / QMI 519 | |
