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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
2172
| | | Family Code | 05E | | | Package Type | Power 33 | | | Package Description | 6LD, MLP, JEDEC, MO-229, DUAL, 3MM SQUARE | | | Pin Count | 6 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 70 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 4000 | V | | ESD Machine Model (MM) | 400 | V | | Package Assembly* | | DAP Size | 6L | | | Frame Material | 1.37X1.85/1.02X1.85MM | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | | | Die Attach Type | Epoxy / EN-4620K | |
*If an attribute is listed twice, either can be used on the part.
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