| General Information |
| Device Marking(TOP MARK) | S6&K
&.&2&Z
| |
| Family Code | 05E | |
| Package Description | 6BALL WLCSP, 2X3 ARRAY, 0.5MM PITCH, 300UM BALL | |
| Die Fabrication |
| Fabrication Process Identifier | 5E8FS50BPOAD | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 8000 | V |
| ESD Machine Model (MM) | 400 | V |