FPF2302MX

Dual Output Current Limit Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FPF 2302
Family Code	05E
Package Type	SOIC
Package Description	008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1)
Pin Count	8
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Silver
Lead Pitch	1270
Minimum Lead Spacing	760
Die Fabrication
Fabrication Process Identifier	FS50BPOAD
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	158	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	4000	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
DAP Size	3.56X2.41 MM
Frame Material	Cu
UL Flammability Rating	UL94-V0

*If an attribute is listed twice, either can be used on the part.