| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FQA
13N50C
|
| Family Code | 0SQ |
| Package Type | TO-3P |
| Package Description | 3LD PLAS EXPOSED HEAT SINK |
| Pin Count | 3 |
| FIT | 12.9 |
| Maximum Reflow Temperature | NA (thru hole) |
| MSL Rating | NA (thru hole)| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver |
| Die Fabrication |
| Fabrication Process Identifier | EC1350X |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um |
| Moisture Sensitivity | NA |
|
|
| UL Flammability Rating | TO3P |
| Wire Material | AL |
| Wire Diameter | 12.0 MIL |
| Wire Material | AL |
| Wire Diameter | 6.0 MIL |
