| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FQAF
40N25
|
| Family Code | 0SQ |
| Package Type | TO-3PF |
| Package Description | 3LD PLAS,ISOLATED HEAT SINK |
| Pin Count | 3 |
| FIT | 12.9 |
| Maximum Reflow Temperature | NA (thru hole) |
| MSL Rating | NA (thru hole)| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver |
| Die Fabrication |
| Fabrication Process Identifier | EK4025X |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um |
| Moisture Sensitivity | NA |
| DAP Size | BARE COPPER |
| Frame Material | SINGLE GAGE SINGLE |
| Wire Material | AL |
| Wire Diameter | 6.0 MIL |
|
|
| Wire Material | AL |
| Wire Diameter | 15.0 MIL |
