FQB8N60CTM

600V N-Channel Advance QFET® C-Series

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FQB 8N60C
Family Code	0SQ
Package Type	TO-263(D2PAK)
Package Description	002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45)
Pin Count	2
FIT	12.9
Die Fabrication
Fabrication Process Identifier	EC0860X
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
UL Flammability Rating	DPG
Wire Material	AL
Wire Diameter	6.0 MIL
DAP Size	246*190MILS
Frame Material	L-BEND
Wire Material	AL
Wire Diameter	10.0 MIL

*If an attribute is listed twice, either can be used on the part.