| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FQD
10N20C
| |
| Family Code | 0SQ | |
| Package Type | TO-252(DPAK) | |
| Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | |
| Pin Count | 3 | |
| FIT | 12.9 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | 1 | |