FQPF13N06L

60V N-Channel Logic level QFET®

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FQPF 13N06L
Family Code	0SQ
Package Type	TO-220F
Package Description	003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK
Pin Count	3
FIT	12.9
Die Fabrication
Fabrication Process Identifier	EL1306X
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA
Electrical Test
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
Wire Material	AL
Wire Diameter	12.0MILS
DAP Size	283*244 MILS
Frame Material	DUAI GAGE SINGLE STAND
Wire Material	AL
Wire Diameter	6.0 MIL

*If an attribute is listed twice, either can be used on the part.