FQPF2N60C

600V N-Channel QFET® MOSFET

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K FQPF 2N60C
Family Code	0SQ
Package Type	TO-220F
Package Description	003, PLASTIC MOLDED TO220-3 LDS, ISOLATED HEAT SINK
Pin Count	3
FIT	12.9
Die Fabrication
Fabrication Process Identifier	EC0260X
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA
DAP Size	283*244 MILS
Frame Material	DUAI GAGE SINGLE STAND
Wire Material	AL
Wire Diameter	10.0 MIL
Wire Material	AL
Wire Diameter	2.0 MIL

*If an attribute is listed twice, either can be used on the part.