| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
FQU
10N20C
| |
| Family Code | 0SQ | |
| Package Type | TO-251(IPAK) | |
| Package Description | 3LD PLAS EXPOSED HEAT SINK,LEAD 9.30 | |
| Pin Count | 3 | |
| FIT | 12.9 | |
| MSL Rating | | | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | NA | |
| Wire Material | AL | |
| Wire Diameter | 10.0 MIL | |
| Wire Material | AL | |
| Wire Diameter | 6.0 MIL | |
|
|
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 159*128MILS | |
| Frame Material | NI | |
