| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&3
6X1220R
| |
| Family Code | 0SV | |
| Package Description | PDD STD, D2PAK-6L | |
| Die Fabrication |
| Fabrication Process Identifier | MULTI_CHIP | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 80 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2 | V |
| ESD Charged Device Model (CDM) | 500 | V |
| ESD Machine Model (MM) | 300 | V |