| General Information |
| Device Marking(TOP MARK) | &2&K
1259
$Y&Z
| |
| Family Code | 063 | |
| Package Type | US8 | |
| Package Description | 8 LD, MOLDED, VSOP, .7MMX3.1MMX2.0MM | |
| Pin Count | 8 | |
| FIT | 35.3 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Zinc | |
| Lead Pitch | 500 | |
| Minimum Lead Spacing | 230 | |
| Die Fabrication |
| Fabrication Process Identifier | 63650BCFLBD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 9000 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 400 | V |
