|  |
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
FSA
2257
| | | Family Code | 063 | | | Package Type | MSOP | | | Package Description | 10LD, MOLDED, MINI SO PACKAGE, .118 WIDE | | | Pin Count | 10 | | | FIT | 35.3 | | | Die Fabrication | | Fabrication Process Identifier | 636FS50BC5SD | | | Package Assembly* | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 8000 | V | | ESD Charged Device Model (CDM) | 2000 | V |
*If an attribute is listed twice, either can be used on the part.
back to top
|