FSA2258L10X

Low-Voltage 0.8ohm Dual-SPDTAnalog Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	JS
Family Code	063
Package Type	MicroPak
Package Description	10LD, MICROPAK MLP, 1.6MM X 2.1MM (PREMOLDED)
Pin Count	10
FIT	35.3
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiAu
Base Metal/Leadframe Material	Cu with NiPdAu
Lead Pitch	650
Minimum Lead Spacing	350
Die Fabrication
Fabrication Process Identifier	FS35C32BD
Package Assembly*
Plating Finish Layer Thickness	0.5um - 1.5um Au
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	9999	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
DAP Size	10L
Frame Material	1.6X2.1MM
Wire Material	Au
Wire Diameter	0.8 MIL

*If an attribute is listed twice, either can be used on the part.