FSA2357BQX
Low Ron 3:1 Analog Switch
Test Standards: - Moisture Sensitivity: 1
- Physical Dimensions: DQFN
- ESD HBM: 8000
- ESD CDM: 2000
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
2357
| | | Family Code | 063 | | | Package Type | DQFN | | | Package Description | 14LD,DQFN,JEDEC MO-241,2.5X3.0 MM | | | Pin Count | 14 | | | FIT | 35.3 | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Sn | | | Die Fabrication | | Fabrication Process Identifier | 50BCFLBD | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 8000 | V | | ESD Charged Device Model (CDM) | 2000 | V | | Package Assembly* | | DAP Size | 3X2.5 MM | | | Wire Material | Au | | | Wire Diameter | 1.0 MIL | | | Die Attach Type | Epoxy / EN-4620K | |
*If an attribute is listed twice, either can be used on the part.
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