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| General Information | | Device Marking(TOP MARK) | GD
| | Family Code | 063 | | Package Type | UMLP | | Package Description | 16LD, UMLP, 1.8MM X 2.6MM (PREMOLDED) | | Pin Count | 16 | | FIT | 35.3 | | Die Fabrication | | Fabrication Process Identifier | 636FS35C32B | | Package Assembly* | | Moisture Sensitivity | 1 | | DAP Size | 1.8X2.6MM | | Frame Material | 0.4P | | Wire Material | Au | | Wire Diameter | 0.8 MIL |
*If an attribute is listed twice, either can be used on the part.
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