| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FSA
2467
| |
| Family Code | 0GF | |
| Package Type | MLP | |
| Package Description | 16LD,MLP,JEDEC MO-220,3MM SQUARE | |
| Pin Count | 16 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu | |
| Die Fabrication |
| Fabrication Process Identifier | GF6FS35C32B | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 4500 | V |
| ESD Charged Device Model (CDM) | 1500 | V |
| ESD Machine Model (MM) | 200 | V |
| Package Assembly* |
| DAP Size | 16L | |
| Frame Material | 3.06X3.06MM | |
| Die Attach Type | Epoxy / EN-4620K | |
| Wire Material | Au | |
| Wire Diameter | 1.0 MIL | |
