FSA3357L8X

Low Voltage SP3T Analog Switch (3:1 Multiplexer/Demultiplexer)


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MicroPak
  • ESD HBM: 5500
  • ESD CDM: 350
  • ESD MM: 2000


AttributeValueUOM
General Information
Device Marking(TOP MARK)FE  
Family Code063 
Package TypeMicroPak 
Package DescriptionMICROPAK,1.60MM X 1.60MM,8 LEADS 
Pin Count8 
FIT35.3 
Maximum Reflow Temperature260C 
Restriction of Hazardous Substance
Standard Plating FinishNiAu 
Base Metal/Leadframe MaterialCu with NiPdAu 
Lead Pitch650 
Minimum Lead Spacing350 
Die Fabrication
Fabrication Process IdentifierTBD 
Package Assembly*
Plating Finish Layer Thickness0.5um - 1.5um Au 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)5500V
ESD Charged Device Model (CDM)350V
ESD Machine Model (MM)2000V

*If an attribute is listed twice, either can be used on the part.

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