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| General Information | | Device Marking(TOP MARK) | FX
| | Family Code | 063 | | Package Type | MicroPak | | Package Description | 6LD, MICROPAK MLP, 1.0MM X 1.45MM (PREMOLDED) | | Pin Count | 6 | | FIT | 35.3 | | Maximum Reflow Temperature | 260C | | MSL Rating | 1| | | Restriction of Hazardous Substance | | Standard Plating Finish | NiAu | | Base Metal/Leadframe Material | BT Substrate with NiPdAu | | Lead Pitch | 650 | | Minimum Lead Spacing | 350 | | Die Fabrication | | Fabrication Process Identifier | 63650BCFLB | | Package Assembly* | | Plating Finish Layer Thickness | 0.5um - 1.5um Au | | Moisture Sensitivity | 1 | | Wire Material | Au | | Wire Diameter | 0.8 MIL | | DAP Size | 6L | | Frame Material | 1.45X1.0MM |
*If an attribute is listed twice, either can be used on the part.
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