| General Information |
| Device Marking(TOP MARK) | GT
|
| Family Code | 063 |
| Package Type | MicroPak |
| Package Description | 6LD, MICROPAK MLP, 1.0MM X 1.45MM (PREMOLDED) |
| Pin Count | 6 |
| FIT | 35.3 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiAu |
| Base Metal/Leadframe Material | BT Substrate with NiPdAu |
| Lead Pitch | 650 |
| Minimum Lead Spacing | 350 |
| Die Fabrication |
| Fabrication Process Identifier | 636FS35C32BD |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5um - 1.5um Au |
| Moisture Sensitivity | 1 |
| Wire Material | Au |
| Wire Diameter | 0.8 MIL |
| DAP Size | 6L |
| Frame Material | 1.45X1.0MM |
