| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FSAL200
|
| Family Code | 063 |
| Package Type | QSOP |
| Package Description | 016,SH SO,QTR SZ 150MIL WD 25 MIL PCH JEDEC |
| Pin Count | 16 |
| FIT | 35.3 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver |
| Lead Pitch | 635 |
| Minimum Lead Spacing | 381 |
| Die Fabrication |
| Fabrication Process Identifier | 636IF80C |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 2 |
