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| General Information | | Device Marking(TOP MARK) | $Y
FSAM75SM60A
&H&E&E&E&E&E&3
| | | Family Code | 0SC | | | Package Type | SPM32-DA | | | Package Description | PDD STD, SPM32-DA | | | Pin Count | 32 | | | FIT | 11.2 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 1 | °C/Watt | | Thermal Impedance (Theta JC) | 1 | °C/Watt | | Moisture Sensitivity | NA | | |
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| Wire Material | AL | | | Wire Diameter | 20.0 MIL | | | Wire Material | AU | | | Wire Diameter | 1.3 MIL | | | Wire Material | AL | | | Wire Diameter | 8.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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