| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FSAV430
| |
| Family Code | 063 | |
| Package Type | QSOP | |
| Package Description | 016,SH SO,QTR SZ 150MIL WD 25 MIL PCH JEDEC | |
| Pin Count | 16 | |
| FIT | 35.3 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver | |
| Lead Pitch | 635 | |
| Minimum Lead Spacing | 381 | |
| Die Fabrication |
| Fabrication Process Identifier | 636FS50BC5S | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 2 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 4000 | V |
| ESD Charged Device Model (CDM) | 1000 | V |
| ESD Machine Model (MM) | 100 | V |
