FSB50550U

Smart Power Module (SPM®)

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y FSB50550U &H&E&E&E&3
Family Code	0SC
Package Type	SPM23-AD
Package Description	PDD_STD_MINI DUAL IN LINE PACKAGE OF SPM23-AD
Pin Count	23
FIT	11.2
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA
DAP Size	SPM
Wire Material	AU
Wire Diameter	1.3 MIL

*If an attribute is listed twice, either can be used on the part.