FSBB15CH60C
Smart Power Module (SPM®)
Test Standards: - Moisture Sensitivity: NA
- Thermal Impedance: 999/999
- Physical Dimensions: SPM27-CC
- ESD CDM: 1500
| General Information | | Device Marking(TOP MARK) | $Y
FSBB15CH60C
&H&E&E&E&E&E&3
DH&H&3
| | | Family Code | 0SC | | | Package Type | SPM27-CC | | | Package Description | PDD STD, SPM27-CC (AL2O3 DBC, VS LONG INNER BOND), SPM3-V4 | | | Pin Count | 27 | | | FIT | 11.2 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | NA | | | Electrical Test | | ESD Charged Device Model (CDM) | 1500 | V | | Package Assembly* | |
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| UL Flammability Rating | SPM | | | Wire Material | AL | | | Wire Diameter | 8.0 MIL | | | DAP Size | SPM | | | Wire Material | AU | | | Wire Diameter | 1.3 MIL | |
*If an attribute is listed twice, either can be used on the part.
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