FSBB20CH60CL
Smart Power Module, Motion-SPM™
Test Standards: - Moisture Sensitivity: NA
- Thermal Impedance: 3/3
- Physical Dimensions: SPM27-CB
- ESD HBM: 0
- ESD CDM: 0
| General Information | | Device Marking(TOP MARK) | $Y
FSBB20CH60CL
&H&E&E&E&E&E&3
EC&H&3
| | | Family Code | 0SC | | | Package Type | SPM27-CB | | | Package Description | PDD_STD, DBC TYPE, SHORT LEAD_SPM3V_VER4 | | | Pin Count | 27 | | | FIT | 11.2 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 3 | °C/Watt | | Thermal Impedance (Theta JC) | 3 | °C/Watt | | Moisture Sensitivity | NA | | | DAP Size | SPM | | | Wire Material | AU | | | Wire Diameter | 1.3 MIL | | |
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| UL Flammability Rating | SPM | | | Wire Material | AL | | | Wire Diameter | 8.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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