| General Information |
| Device Marking(TOP MARK) | $Y
FSBF3CH60B
&H&E&E&E&E&3
CF&H&3
| |
| Family Code | 0SC | |
| Package Type | SPM27-JA | |
| Package Description | PDD STD, SPM27-JA ( SPM3-V4F) | |
| Pin Count | 27 | |
| FIT | 11.2 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 3 | °C/Watt |
| Thermal Impedance (Theta JC) | 3 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Charged Device Model (CDM) | 500 | V |
| Package Assembly* |
| DAP Size | SPM | |
| Wire Material | AL | |
| Wire Diameter | 8.0 MIL | |
| Wire Material | AU | |
| Wire Diameter | 1.3 MIL | |
|
|
| UL Flammability Rating | SPM | |
