FSBF3CH60B
Smart Power Module (SPM®)
Test Standards: - Moisture Sensitivity: NA
- Thermal Impedance: 3/3
- Physical Dimensions: SPM27-JA
- ESD CDM: 500
| General Information | | Device Marking(TOP MARK) | $Y
FSBF3CH60B
&H&E&E&E&E&3
CF&H&3
| | | Family Code | 0SC | | | Package Type | SPM27-JA | | | Package Description | PDD STD, SPM27-JA ( SPM3-V4F) | | | Pin Count | 27 | | | FIT | 11.2 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 3 | °C/Watt | | Thermal Impedance (Theta JC) | 3 | °C/Watt | | Moisture Sensitivity | NA | | | Electrical Test | | ESD Charged Device Model (CDM) | 500 | V | | Package Assembly* | |
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| UL Flammability Rating | SPM | | | Wire Material | AL | | | Wire Diameter | 8.0 MIL | | | Wire Material | AU | | | Wire Diameter | 1.3 MIL | | | DAP Size | LONG SLOT ON BSD DAP | | | Frame Material | SPM | |
*If an attribute is listed twice, either can be used on the part.
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