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| General Information | | Device Marking(TOP MARK) | DM311
A&Z&3
| | | Family Code | 0SG | | | Package Type | DIP | | | Package Description | 008,PLASTIC, MOLDED DIP | | | Pin Count | 8 | | | FIT | 3 | | | Die Fabrication | | Fabrication Process Identifier | SDG4 | | | Package Assembly* | | Thermal Impedance (Theta JA) | 89 | °C/Watt | | Thermal Impedance (Theta JC) | 14 | °C/Watt | | Moisture Sensitivity | NA | | | Electrical Test | | ESD Human Body Model (HBM) | 2000 | V | | ESD Charged Device Model (CDM) | 500 | V | | ESD Machine Model (MM) | 300 | V |
*If an attribute is listed twice, either can be used on the part.
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