| General Information |
| Device Marking(TOP MARK) | $Y&Z&E&E&3
FSFR2100
| |
| Family Code | 0SU | |
| Package Type | SIP | |
| Package Description | 9LD,SIP MODULE,3 DIE, FORMED LEAD | |
| Pin Count | 9 | |
| Die Size X | 1910 | MLL |
| Die Size Y | 2440 | MLL |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 10 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 2000 | V |
| ESD Charged Device Model (CDM) | 1500 | V |
| ESD Machine Model (MM) | 300 | V |
| Package Assembly* |
|
|
| DAP Size | FPS | |
| Wire Material | AU | |
| Wire Diameter | 1.5 MIL | |