FSLV16211MTDX

24-Bit Bus Switch

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FSLV16211
Family Code	0RF
Package Type	TSSOP
Package Description	056,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC
Pin Count	56
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Magnesium,Silicon,Silver
Lead Pitch	500
Minimum Lead Spacing	230
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	2
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	1.0 MIL
DAP Size	3.5X5.0MM
Frame Material	Cu

*If an attribute is listed twice, either can be used on the part.