| General Information |
| Device Marking(TOP MARK) | Q0265R
&E&E&Z&3
| |
| Family Code | 0SG | |
| Package Type | DIP | |
| Package Description | PDD STD_ 8-DIP-300 | |
| Pin Count | 8 | |
| Die Size X | 2700 | MLL |
| Die Size Y | 3140 | MLL |
| FIT | 3 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Die Fabrication |
| Fabrication Process Identifier | AR3752X | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um | |
| Thermal Impedance (Theta JA) | 80 | °C/Watt |
| Thermal Impedance (Theta JC) | 18 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 1500 | V |
| ESD Charged Device Model (CDM) | 2000 | V |
| ESD Machine Model (MM) | 200 | V |
