FSQ100

SMPS Power Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K Q100
Family Code	0SG
Package Type	MDIP
Package Description	8LD, MDIP, JEDEC MS-001, .300" WIDE, TWO DAP
Pin Count	8
FIT	3
Die Fabrication
Fabrication Process Identifier	SDG4
Package Assembly*
Thermal Impedance (Theta JA)	89	°C/Watt
Thermal Impedance (Theta JC)	14	°C/Watt
Moisture Sensitivity	NA
Electrical Test
ESD Human Body Model (HBM)	2000	V
ESD Charged Device Model (CDM)	1500	V
ESD Machine Model (MM)	300	V

*If an attribute is listed twice, either can be used on the part.