FSSD06BQX

SD/SDIO and MMC 6PDT 2 Port Multiplexer

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K FSSD 06
Family Code	083
Package Type	MLP
Package Description	24LD,DQFN,JEDEC MO-241,3.5X4.5 MM
Pin Count	24
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Die Fabrication
Fabrication Process Identifier	FS35C32B
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	5000	V
ESD Charged Device Model (CDM)	2000	V
Package Assembly*
DAP Size	4.5X3.5 MM
Die Attach Type	Epoxy / EN-4620K
Wire Material	Au
Wire Diameter	1.0 MIL

*If an attribute is listed twice, either can be used on the part.