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| General Information | | Device Marking(TOP MARK) | FG
| | | Family Code | 063 | | | Package Type | UMLP | | | Package Description | 24LD, UMLP, 2.5MM X 3.4MM (PREMOLDED) | | | Pin Count | 24 | | | FIT | 35.3 | | | Die Fabrication | | Fabrication Process Identifier | 636FS35C32B | | | Package Assembly* | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 5000 | V | | ESD Charged Device Model (CDM) | 2000 | V | | Package Assembly* | | Wire Material | Au | | | Wire Diameter | 0.8 MIL | | | DAP Size | 2.5X3.4MM | | | Frame Material | 0.4P | |
*If an attribute is listed twice, either can be used on the part.
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