| General Information |
| Device Marking(TOP MARK) | $Y&Z&2
F3306&C
|
| Family Code | 08W |
| Package Type | TSSOP |
| Package Description | 008,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC |
| Pin Count | 8 |
| FIT | 5.7 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Silver |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |