| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FST3384
|
| Family Code | 08W |
| Package Type | QSOP |
| Package Description | 024,SH SO,QTR SZ 150MIL WD 25 MIL PCH JEDEC |
| Pin Count | 24 |
| FIT | 5.7 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Lead (RoHS Exempt),Silver |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
|
|
| UL Flammability Rating | UL94-V0 |
| Die Attach Type | Epoxy / Poly 6 |
| Wire Material | Au |
| Wire Diameter | 0.9 MIL |
| DAP Size | 96X140 MIL |
| Frame Material | Cu |
