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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
USB20
| | Family Code | 063 | | Package Type | DQFN | | Package Description | 14LD,DQFN,JEDEC MO-241,2.5X3.0 MM | | Pin Count | 14 | | FIT | 35.3 | | MSL Rating | | | | Restriction of Hazardous Substance | | Standard Plating Finish | Sn | | Die Fabrication | | Fabrication Process Identifier | TBD | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | 1 | | DAP Size | 3X2.5 MM | | Die Attach Type | Epoxy / EN-4620K | | Wire Material | Au | | Wire Diameter | 1.0 MIL |
*If an attribute is listed twice, either can be used on the part.
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