FSUSB22MTCX

Low Power 2 Port Hi-Speed USB 2.0 (480Mbps) Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K USB22
Family Code	08Z
Package Type	TSSOP
Package Description	016,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC
Pin Count	16
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	650
Minimum Lead Spacing	350
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	4000	V
ESD Charged Device Model (CDM)	1000	V
ESD Machine Model (MM)	100	V
Package Assembly*
DAP Size	HD
Frame Material	2.0 SQ
Wire Material	Au
Wire Diameter	0.8 MIL
Die Attach Type	Epoxy / QMI 519

*If an attribute is listed twice, either can be used on the part.