FSUSB23BQX

Low Power Hi-Speed USB 2.0 (480 Mbps) Switch

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K USB23
Family Code	08Z
Package Type	DQFN
Package Description	16LD,DQFN,JEDEC MO-241,2.5X3.5 MM
Pin Count	16
Restriction of Hazardous Substance
Standard Plating Finish	Sn
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Moisture Sensitivity	1
DAP Size	3.5X2.5
Frame Material	0.5P
Wire Material	Au
Wire Diameter	1.0 MIL
Die Attach Type	Epoxy / EN-4620K

*If an attribute is listed twice, either can be used on the part.