FSUSB23L10X

Low Power Hi-Speed USB 2.0 (480 Mbps) Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	EZ
Family Code	08Z
Package Type	MicroPak
Package Description	MICROPAK,1.60MM X 2.10MM,10 LEADS
Pin Count	10
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiAu
Base Metal/Leadframe Material	Cu with NiPdAu
Lead Pitch	650
Minimum Lead Spacing	350
Die Fabrication
Fabrication Process Identifier	FS50BC5S
Package Assembly*
Plating Finish Layer Thickness	0.5um - 1.5um Au
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	7000	V
ESD Charged Device Model (CDM)	1000	V
ESD Machine Model (MM)	350	V

*If an attribute is listed twice, either can be used on the part.